The formula to calculate the Die Yield is:
\[ Y = \left(\frac{\text{Wa}}{\text{S} + 2\sqrt{\text{A} \cdot \text{D}}}\right)^2 \cdot e^{-\pi \cdot \text{D} \cdot \left(\frac{\text{D}}{\text{A}}\right)} \]
Where:
Die yield refers to the number of good, usable chips that can be obtained from a single silicon wafer during the manufacturing process. It is a critical factor in semiconductor manufacturing as it directly impacts the cost and efficiency of production. The die yield is influenced by various factors such as the size of the chip, defects in the wafer, and the precision of the manufacturing process. A higher die yield means more functional chips per wafer, leading to lower production costs.
Let's assume the following values:
Using the formula to calculate the Die Yield (Y):
\[ Y = \left(\frac{10000}{50 + 2\sqrt{50 \cdot 0.01}}\right)^2 \cdot e^{-\pi \cdot 0.01 \cdot \left(\frac{0.01}{50}\right)} \approx 37829.5 \]
The Die Yield is approximately37829.5.
